Who is this course for?
This course is ideal for individuals with responsibilities for ensuring the quality and reliability of electronic assemblies. It is particularly well-suited for training and quality supervisors with expertise in electronic assembly. Additionally, engineering and manufacturing supervisors with assembly responsibilities will find this course highly beneficial.
Topics covered
- Establishing and Maintaining the Integrity of the Training Program
- Purpose and Application of IPC-A-610 Standards
- Hardware Installation Guidelines
- Soldering Criteria, Including Lead-Free Connections
- Requirements for Soldered Connections to Terminals
- Soldered Connection Requirements for Plated-Through Holes
- Surface Mounting Criteria for Chip Components, Leadless, and Leaded Chip Carriers
- Swaged Hardware and Heatsink Requirements in Mechanical Assemblies
- Component Mounting Criteria for DIPS, Socket Pins, and Card Edge Connectors
- Jumper Wire Assembly Requirements
- Solder Fillet Dimensional Criteria for All Major SMT Component Groups
- Detailed Examination of Soldering Issues, such as Tombstoning, Dewetting, Voiding, and Others
- Criteria for Component Damage, Laminate Conditions, Cleaning, and Coating
- Effective Utilization of the Lesson Plan and Materials, Inspection Tips, and a Review of Important Certified IPC Trainer Skills
What's included?
- Downloadable student files from IPC (CIT only)
- IPC Certificate upon successful completion of class and test
- Snacks, refreshments, and lunch daily
Training location
Training will be held on March 10-13 at ÌìÃÀ´«Ã½ Baltimore in Baltimore, MD or March 24-27 at ÌìÃÀ´«Ã½ Anaheim in Anaheim, CA.
Registration and course information
Contact William Graver (Master IPC Trainer) for scheduling, registration, pricing, or technical questions. Email or call +1 410-937-2638.
Do you or your team members require IPC certification?
Sign up or request more information
About the Master IPC Trainer
William Graver
William Graver is a seasoned professional with more than 30 years in the PCB and PCA manufacturing industry. Currently serving as a Program Manager / Master IPC Trainer at ÌìÃÀ´«Ã½'s Baltimore lab, he specializes in PCB/PCA Failure Analysis and IPC training, and holds the following certifications:
- MIT (Master IPC Trainer) IPC-A-600
- MIT (Master IPC Trainer) IPC-A-610
- MIT (Master IPC Trainer) IPC-6012
- MIT (Master IPC Trainer) IPC/WHMA-A-620
ÌìÃÀ´«Ã½ in Printed Circuit Board (PCB) & Printed Circuit Board Assembly (PCBA)
Ensure the highest quality and compliance of your printed circuit boards with ÌìÃÀ´«Ã½'s comprehensive testing services. Our expertise covers all PCB stages, from raw materials to failure analysis, adhering to industry standards like IPC and MIL-PRF. Our advanced methods, including visual assessment, cross-sectioning, and Highly Accelerated Thermal Shock (HATS2™) Testing, ensure efficient and reliable evaluations.
ÌìÃÀ´«Ã½'s over 30 years of experience positions us as a trusted partner for PCB qualification and conformance testing, offering expert support and root cause analysis when needed.